Abstract
Thermal Properties of Polyimide Composites with Nanostructured Silicon Carbide
Alyona Igorevna Wozniak, Vitaly Sergeyevich Ivanov, Olga Vladimirovna Kosova and Anton Sergeyevich Yegorov
DOI : http://dx.doi.org/10.13005/ojc/320616
Abstract:
A series of polyimide composites reinforced with different loadings of silicon carbide (SiC) nanoparticles are prepared by in-situ polymerization technique. The polyimide (PI) matrix resin is derived from 4,4’-oxydianiline (4,4’-ODA) and pyromelliticdianhydride (PMDA). The dispersions of SiC nanoparticles are prepared via ultrasonic irradiation or mechanical homogenization. In this method, the SiC nanoparticles are dispersed in diamine solution followed by polymerization with dianhydride. The composites obtained under sonication were found to have lower thermal properties than composites prepared under homogenization.
Keywords:polymer composite; silicon carbide; polyimide; particle-reinforced nanocomposite; sonication; mechanical homogenization
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