Abstract

M. C. Patel* and A. D. Shah

An amino end capped oligoimide was prepared by the Michael addition reaction of hexamethylene bismaleimide (HBM) and 4,4'-diamino diphenyl-sulphone (DDS) at an HBM:DDS molar ratio of 1:2. The poly (amide-imide)s (PAI)s were prepared by condensation of this HBMDDS oligoimide with various aliphatic bisesters. The resultant PAIs were characterized by elemental analysis and the average molecular weight estimated by non-aqueous conductometric titration and thermogravimetry. The curing reaction of an expoxy resin [a diglycidyl ether of bisphenol-A (DGEBA)] with PAIs was monitored by differential scanning calorimetry (DSC). Glass and carbon reinforced laminates of PAI-epoxy resin were also prepared and characterized.

Hexamethylene bismaleimide (HBM); Poly(amide-imide) PAI; Glass fibre reinforced composites (GFRC); Carbon fibre reinforced composites (CFRC)

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