ISSN : 0970 - 020X, ONLINE ISSN : 2231-5039
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Novel Bismaleimide-Epoxy Resin System

K. D. Patel

V. P. and R.P.T.P. Science College, Vallabh Vidyanagar - 388 120, India.

Article Publishing History
Article Received on : February 25,1999
Article Accepted on :
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ABSTRACT:

Novel (famines, namely N,N'-bis[1 -(2-methyl-4-aminophenyl)ethanoyl]-1,4-benzene-diamine (BMAED 1) and N,N'-bis[1-(4-methyl-3-aminophenyl)ethanoy]-1,4-benzene-diamine(BMAED 2), have been prepared and reacted with various bismaleimides (BM) at a BM:diamine ratio of 1:2.The resulting oligoimides have been characterized by elemental analysis, IR spectral studies and tie number average molecular weight (Mn) estimated by non-aqueous conductometric titration and thermogravimetry. Some of the oligoimides have been modified by addition (i.e. curing reaction of epoxy resin, namely the diglycidyl ether of bisphenol-A, and studied by differential calorimetry (DSC). The glass and carbon reinforced composites have also been prepared and characterized by their mechanical properties.

KEYWORDS:

oligoimides; non-aqueous conductometric titration; calorimetry

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Patel K. D. Novel Bismaleimide-Epoxy Resin System. Orient J Chem 1999;15(3)


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Patel K. D. Novel Bismaleimide-Epoxy Resin System. Orient J Chem 1999;15(3). Available from:http://www.orientjchem.org/?p=37040



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